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Solder paste, unleaded

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703000

Empty jar - for soldering paste, holds 500gr.

703055

A fast print, no clean solder paste (ranging from 20-300mm per second), pin testable, slump free, no solder balls.
Profile and printer friendly.

Particle Size

25-45 µm

703617

Solder paste for storage at room temperature.

6-month shelf life at room temp., inhibiting metallic salts.

Improves workability and avoids quality changes during transportation

Room temperature storage eliminates concerns such as "quality change in continual use", "wait period after taking out of the refrigerator", and "degradation for forgetting to put into a refrigerator". Significant improvement in production efficiency and higher cost benefits by reducing waste amount can be achieved.

Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature.

703651

The S3X48-M500 printable no-clean lead-free solder pastes are formulated to resist head-in-pillow defects.
The halogen-free pastes wet well on pc boards, including OSP, NiAu, Sn, and HASL (SAC305), and retain flux activation during long reflow processing in peak temperatures of 230° to 250°.

The pastes have a viscosity of 220 Pa.S and melt between 217° to 219°C.
Tack time is ≥48 hours, and the pastes have a shelf life (below 10C) of 6 months.

Solder paste S3X58-M500ECO+PLUS, 500gr unleaded, jar
703655

Super Low-Void & Anti-pillow

No-clean lead free solder paste

Ensures outstanding continual printablility with super fine
pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications for normal to
fast printing (10 ~ 80mm/sec.) and long stencil idle time.

Highly heat resisting and perfect melting and wetting at
super fine pitch (<0.4mm pitch) and micro components (<0.3mm dia
CSP, 0603 chip).

Conforms to Halogen-free standard (Cl + Br: below1500ppm) EN-14582

S3x58-M500 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.

It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.

703665

Powerful Wetting Lead Free Solder Paste

Sn 3.0Ag 0.5Cu

Excellent wetting to severely oxidized patterns or components,
such as oxidized Cu substrate, oxidized Sn and NiPd plating.

Perfect melting and wetting at super fine pitch (>0.4mm pitch) and
micro components (>0.30mm dia CSP, 0603 chip).

S3x58-M500C-5 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.

It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.

 

 

703666

Upgraded Powerful Wetting General Purpose Solder Paste

Sn 3.0Ag 0.5Cu

S3X58-M500C-7 has good and consistent wetting
spreading to oxidized metal surface.

After removal of oxide film at pre-heating stage, a new protective film is formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.

1kg cartridge

 

 

 

703667

Ultra Low Void Lead Free Solder Paste

Ensures stable and ultra low voiding regardless of component type and reflow profiles.

Composition Sn 3.0Ag 0.5Cu

703668

Upgraded Powerful Wetting General Purpose Solder Paste

Sn 3.0Ag 0.5Cu

S3X58-M500C-7 has good and consistent wetting

spreading to oxidized metal surface.

After removal of oxide film at pre-heating stage, a new protective film is formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.

0,6kg cartridge

703669

Upgraded Powerful Wetting General Purpose Solder Paste

Sn 3.0Ag 0.5Cu

S3X58-M500C-7 has good and consistent wetting

spreading to oxidized metal surface.

After removal of oxide film at pre-heating stage, a new protective film is formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.

500gr jar

703671

Powerful Wetting Lead Free Solder Paste

Sn 3.0Ag 0.5Cu

Excellent wetting to severely oxidized patterns or components, such as oxidized Cu substrate, oxidized Sn and NiPd plating.

Perfect melting and wetting at super fine pitch (>0.4mm pitch) and
micro components (>0.30mm dia CSP, 0603 chip).

S3x58-M500C-5 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.

It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.

703675

Halogen Free Pin Testable Solder Paste 

Sn 3.0Ag 0.5Cu

S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.

Superior wetting ability prevents voiding

For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S3X58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.

"Halogen-free" – addressing the environment

One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free. Halogen-free S3X58-M650-7 meets such demands while providing both reliability and workability.

703900

Multi-feature Halogen-free LF Solder Paste

By adopting newly developed techniques through our expertise and experiences, has gained excellent results in all soldering features such as wetting, ICT testing, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc.
S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.

Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten.

The flux formulation of S3X58-HF1100 solder paste is specifically designed to exhibit enhanced flux coagulation at the time when the solder starts to melt. Instant coagulation and evacuation of the liquified flux when the solder gets molten, brings about various benefits in soldering performance such as reduction in voiding rate and flux splattering, and improved wetting and ICT properties.

Composition: Sn 3.0Ag 0.5Cu

Particle size (μm): 20-38

Flux content (%): 11,7

Flux type: ROLO

Melting point (℃): 217-219

Viscosity (Pa.s): 190

Halide content (%): 0

 

Solder paste S3X58-HF1100-3, 500gr
703905

Multi-feature Halogen-free LF Solder Paste

By adopting newly developed techniques through our expertise and experiences, has gained excellent results in all soldering features such as wetting, ICT testing, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc.

S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.

Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten.

The flux formulation of S3X58-HF1100 solder paste is specifically designed to exhibit enhanced flux coagulation at the time when the solder starts to melt. Instant coagulation and evacuation of the liquified flux when the solder gets molten, brings about various benefits in soldering performance such as reduction in voiding rate and flux splattering, and improved wetting.

Newly designed flux coagulation technique enables consistently low voiding achieved with each component type and surface finish.

Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217 - 219
Particle Size(μm)
20 - 38 / 10 - 25
Viscosity(Pa.s)
190 ± 30
Flux Content(%)
11.7 ± 1.0 / 12.0 ± 1.0
Halide content(%)
0
Flux Type
ROL0(IPC J-STD-004B and 004C)

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