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Solder paste, unleaded

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703055

A fast print, no clean solder paste (ranging from 20-300mm per second), pin testable, slump free, no solder balls.
Profile and printer friendly.

703617

Solder paste for storage at room temperature.

6-month shelf life at room temp., inhibiting metallic salts.

Improves workability and avoids quality changes during transportation

Room temperature storage eliminates concerns such as "quality change in continual use", "wait period after taking out of the refrigerator", and "degradation for forgetting to put into a refrigerator". Significant improvement in production efficiency and higher cost benefits by reducing waste amount can be achieved.

Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature.

703651

The S3X48-M500 printable no-clean lead-free solder pastes are formulated to resist head-in-pillow defects.
The halogen-free pastes wet well on pc boards, including OSP, NiAu, Sn, and HASL (SAC305), and retain flux activation during long reflow processing in peak temperatures of 230° to 250°.

The pastes have a viscosity of 220 Pa.S and melt between 217° to 219°C.
Tack time is ≥48 hours, and the pastes have a shelf life (below 10C) of 6 months.

Solder paste S3X58-M500ECO+PLUS, 500gr unleaded, jar
703655

Super Low-Void & Anti-pillow

No-clean lead free solder paste

Ensures outstanding continual printablility with super fine
pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications for normal to
fast printing (10 ~ 80mm/sec.) and long stencil idle time.

Highly heat resisting and perfect melting and wetting at
super fine pitch (<0.4mm pitch) and micro components (<0.3mm dia
CSP, 0603 chip).

Conforms to Halogen-free standard (Cl + Br: below1500ppm) EN-14582

S3x58-M500 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.

It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.

703665

Powerful Wetting Lead Free Solder Paste

Sn 3.0Ag 0.5Cu

Excellent wetting to severely oxidized patterns or components,
such as oxidized Cu substrate, oxidized Sn and NiPd plating.

Perfect melting and wetting at super fine pitch (>0.4mm pitch) and
micro components (>0.30mm dia CSP, 0603 chip).

S3x58-M500C-5 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.

It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.

 

 

703666

Upgraded Powerful Wetting General Purpose Solder Paste

Sn 3.0Ag 0.5Cu

S3X58-M500C-7 has good and consistent wetting
spreading to oxidized metal surface.

After removal of oxide film at pre-heating stage, a new protective film is formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.

 

 

 

703667

Ultra Low Void Lead Free Solder Paste

Ensures stable and ultra low voiding regardless of component type and reflow profiles.

Composition Sn 3.0Ag 0.5Cu

703671

Powerful Wetting Lead Free Solder Paste

Sn 3.0Ag 0.5Cu

Excellent wetting to severely oxidized patterns or components, such as oxidized Cu substrate, oxidized Sn and NiPd plating.

Perfect melting and wetting at super fine pitch (>0.4mm pitch) and
micro components (>0.30mm dia CSP, 0603 chip).

S3x58-M500C-5 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.

It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.

703675

Halogen Free Pin Testable Solder Paste 

Sn 3.0Ag 0.5Cu

S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.

Superior wetting ability prevents voiding

For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S3X58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.

"Halogen-free" – addressing the environment

One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free. Halogen-free S3X58-M650-7 meets such demands while providing both reliability and workability.

Solder paste S3X70-M500D 10ml, disp. syringe
703716

Dispensing solder paste for super find pitch and micro components

Sn 3.0Ag 0.5Cu

Solder the right "Spot". Not "Area" soldering.

S3X70-M500D minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability.

S3X70-M500D is designed to maintain its activity for a long period of time. During reflow, by removing voids in a long span, S3X70-M500D realizes low voiding for any component.

 

 

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