The S3X48-M500 printable no-clean lead-free solder pastes are formulated to resist head-in-pillow defects.
The halogen-free pastes wet well on pc boards, including OSP, NiAu, Sn, and HASL (SAC305), and retain flux activation during long reflow processing in peak temperatures of 230° to 250°.
The pastes have a viscosity of 220 Pa.S and melt between 217° to 219°C.
Tack time is ≥48 hours, and the pastes have a shelf life (below 10C) of 6 months.