Solder paste, leaded

A no clean solder paste for print definition to below 0.3mm for µBga work.
Microprint P2004 helps eliminate mid chip balling and micro balling, therefore eliminating costly rework.

Alloys: Sn62Pb36Ag2

A fast print, no clean solder paste (ranging from 20-300mm per second), pin testable, slump free, no solder balls.
Profile and printer friendly.

No Clean Leaded Solder Paste

SS48-M956-2 uses carefully classified solder powder with uniform particle size. It has superior workability, solderability and electrical reliability.

It has outstanding continual and intermittent printability even with fine pitch pattern applications.

No Clean Leaded Solder Paste

SS48-M956-2 uses carefully classified solder powder with uniform particle size.
It has superior workability, solderability and electrical reliability.

It has outstanding continual and intermittent printability even with fine pitch pattern applications.

Powerful wetting, no-clean solder paste

Employment of rigidly classified 20∼45 micron solder powder ensures outstanding continual
printability with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application
and long stencil idle time.

SS48-M1000-3 has extremely long stencil idle time and tack time offer wide process window.