Thermal

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

• Excellent non-creep characteristics
• Very high thermal conductivity; 0.9 W/m.K
• Wide operating temperature -50°C to +130°C
• Low evaporation weight loss
• Easy to use and available in aerosol form, HTCA
• Low toxicity

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

• Excellent non-creep characteristics
• Very high thermal conductivity; 0.9 W/m.K
• Wide operating temperature -50°C to +130°C
• Low evaporation weight loss
• Easy to use and available in aerosol form, HTCA
• Low toxicity

10ml syringe

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

• Excellent non-creep characteristics
• Very high thermal conductivity; 0.9 W/m.K
• Wide operating temperature -50°C to +130°C
• Low evaporation weight loss
• Easy to use and available in aerosol form, HTCA
• Low toxicity

20ml syringe

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

• Excellent non-creep characteristics
• Very high thermal conductivity; 0.9 W/m.K
• Wide operating temperature -50°C to +130°C
• Low evaporation weight loss
• Easy to use and available in aerosol form, HTCA
• Low toxicity

35ml syringe

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

• Excellent non-creep characteristics
• Very high thermal conductivity; 0.9 W/m.K
• Wide operating temperature -50°C to +130°C
• Low evaporation weight loss
• Easy to use and available in aerosol form, HTCA
• Low toxicity

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. 

HTCP Non-Silicone Thermal Interface Material is a ‘Plus’ version of Electrolube’s successful HTC which provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

• Excellent non-creep characteristics
• Very high thermal conductivity; 2.50 W/m.K
• Wide operating temperature range: -50°C to +130°C
• Low evaporation weight loss
• White colour enabled treated parts to be easily identified
• Low in toxicity

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. 

HTCP Non-Silicone Thermal Interface Material is a ‘Plus’ version of Electrolube’s successful HTC which provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

• Excellent non-creep characteristics
• Very high thermal conductivity; 2.50 W/m.K
• Wide operating temperature range: -50°C to +130°C
• Low evaporation weight loss
• White colour enabled treated parts to be easily identified
• Low in toxicity

20ml syringe

Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range. 

HTS Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive interface material which will operate over a wide temperature range. Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity of heat dissipation is important.

• Excellent non-creep charactistics
• Vibration stable, designed for gap filling applications
• Thermal conductivity even at high temperatures: 0.90 W/m.K
• Wide operating temperature range: -50°C to +200°C
• Low in toxicity and economical in use
• Low evaporation weight loss

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. 

HTSP Silicone Heat Transfer Compound Plus is a modified ‘Plus’ version of Electrolube’s successful HTS which provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. The exceptional properties obtained from HTSP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

• Superior thermal conductivity even at high temperatures 3.0 W/m.K
• Excellent non-creep characteristics
• Wide operating temperature range -50°C to +200°C
• Low evaporation weight loss

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. 

HTSP Silicone Heat Transfer Compound Plus is a modified ‘Plus’ version of Electrolube’s successful HTS which provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. The exceptional properties obtained from HTSP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

• Superior thermal conductivity even at high temperatures 3.0 W/m.K
• Excellent non-creep characteristics
• Wide operating temperature range -50°C to +200°C
• Low evaporation weight loss

50ml tube