Desoldering Braids

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.
Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.
Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.