HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.
HTCP Non-Silicone Thermal Interface Material is a ‘Plus’ version of Electrolube’s successful HTC which provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.
- Excellent non-creep characteristics
- Very high thermal conductivity; 2.50 W/m.K
- Wide operating temperature range: -50°C to +130°C
- Low evaporation weight loss
- White colour enabled treated parts to be easily identified
- Low in toxicity