Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.
Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.
Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.
Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.
Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.