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Desoldering Braids

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Desoldering Braid LF A 0,64mmx3m SILVER 25/pack (LEADFREE)
LF-A-10AS/25

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.
Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.
Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Desoldering Braid LF B, 1,27mmx 3m GOLD 25/pack (LEADFREE)
LF-B-10AS/25

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Desoldering Braid LF C, 1,9mmx3m GREEN 25/pack (LEADFREE)
LF-C-10AS/25

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Desoldering Braid LF D, 2,54mmx3m BLUE 25/pack (LEADFREE)
LF-D-10AS/25

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

Desoldering Braid LF E, 3,18mmx3m BROWN 25/pack (LEADFREE)
LF-E-10AS/25

Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics.

Easily removes solder from components or pads on a circuit board. Concentrated fine copper braiding utilizes less length of wick for each desoldering application.

Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering 5’ & 10’ lengths spooled on static dissipative bobbins in compliance with ESD Association Standard.

Formulated with a flux designed for higher activation temperatures. To be used in conjunction with processes using RMA type no-clean fluxes.

Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes.

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