Powerful Wetting Lead Free Solder Paste
Sn 3.0Ag 0.5Cu
Excellent wetting to severely oxidized patterns or components,
such as oxidized Cu substrate, oxidized Sn and NiPd plating.
Perfect melting and wetting at super fine pitch (>0.4mm pitch) and
micro components (>0.30mm dia CSP, 0603 chip).
S3x58-M500C-5 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.
It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.