Casting Resin for Electronics
Pot life at 23 °C = 10 min
Cure Time
at 23 °C until fully cured = 8 h
at 80 °C until solid cure = 25 min
at 80 °C until fully cured = 1h
Mechanical Properties
soft-elastic
- excellent mechanical damping up to 1000 G
Electrical Properties
good dielectric
- excellent electrical insulation
- high electric breakdown strength
Flexibility at Low Temperatures
glass transition approx. - 80 °C
- resin stays soft at low temperatures
- excellent mechanical damping, especially at low temperatures
Manufacturing
- variable potlife
- convenient mixing ratio (typically 1:1 to 3:1)
- no exothermic reaction during cure
- virtually no cure shrinkage
Environmental
safety class free according to
91/155/EWG
- no solvents, no VOC
- no epoxy
- no isocyanate
- no silicone
Advantages
- reliable protection against vibration and shock
- extremely low stress on parts and soldered joints
- re-enterable, repair possible
- minimal impact on electronics
- safe to use even at high voltages
- minimal stress on parts and soldered joints at low temperatures and during temperature shocks
- protection against vibration and shock even at low temperatures
- adjustable to process conditions
- easy to manufacture
- easy potting of big volumes
- no special protective measures for production