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During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the compound and the device can lead to reliability concerns and reduced operational lifetime. Electrolube's extensive thermal interface materials & thermal solutions range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.

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Heat Transfer Compound - Non Silicone 1kg
HTC01K

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity

 

Heat Transfer Compound - Non Silicone - Syringe 10ml
HTC10S

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity

10ml syringe

Heat Transfer Compound - Non Silicone - Syringe 20ml
HTC20S

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity

20ml syringe

Heat Transfer Compound - Non Silicone 25kg
HTC25K

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity
Heat Transfer Compound - Non Silicone - Syringe 35ml
HTC35SL

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity

35ml syringe

Heat Transfer Compound - Non Silicone - Cartridge 700g
HTC700G

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required. 

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity
HTC Non Silicone - Aerosol 200ml
HTCA200

Electrolube's Non-Silicone Heat Transfer Compound Aerosol is an innovative new way of applying our standard HTC. 

Electrolube’s Non-Silicone Heat Transfer Compound Aerosol is an innovative new way of applying our standard HTC. The aerosol version offers greater ease of use, allowing a thin, even film of HTC to be applied where required. It is especially useful for applications over larger areas. As with all Electrolube aerosols HTCA is 100% Ozone Friendly. Product contains flammable solvent therefore do not spray onto live electrical equipment or other sources of ignition.

  • Excellent non-creep characteristics
  • Excellent thermal conductivity even at high temperatures: 0.9 W/m.K
  • Wide operating temperature range -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and economic, particularly for larger applications

 

Heat Transfer Compound Plus-Non Silicone 1kg
HTCP01K

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. 

HTCP Non-Silicone Thermal Interface Material is a ‘Plus’ version of Electrolube’s successful HTC which provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 2.50 W/m.K
  • Wide operating temperature range: -50°C to +130°C
  • Low evaporation weight loss
  • White colour enabled treated parts to be easily identified
  • Low in toxicity

 

 

Heat Transfer Compound Plus - Non Silicone - Syringe 20ml
HTCP20S

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. 

HTCP Non-Silicone Thermal Interface Material is a ‘Plus’ version of Electrolube’s successful HTC which provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 2.50 W/m.K
  • Wide operating temperature range: -50°C to +130°C
  • Low evaporation weight loss
  • White colour enabled treated parts to be easily identified
  • Low in toxicity

20ml syringe

Heat Transfer Compound Plus - Non Silicone 25kg
HTCP25K

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. 

HTCP Non-Silicone Thermal Interface Material is a ‘Plus’ version of Electrolube’s successful HTC which provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 2.50 W/m.K
  • Wide operating temperature range: -50°C to +130°C
  • Low evaporation weight loss
  • White colour enabled treated parts to be easily identified
  • Low in toxicity
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